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Bubble Envelope Packaging

    Publish time 2017-09-16 10:41    

Bubble Envelope Packaging                                                         


Material： Composite bubble  
                                                                                   

Useage:  

Transpportation and mail ,   Electronic circuit board, precision electronic machinery parts, PC board, precision hardware    

                                                                                

Feature： 

Anti-static,Shock resistance ;

Waterproof  ;

Premier &easy to wrtie in surface